| PrintNumber | ErrorLocation | Error | Correction | DateAdded |
|---|---|---|---|---|
| 1 | pii | ISBN-13: 978-0-7897-4710-3 ISBN-10: 0-7897-4710-5 |
ISBN-13: 978-0-7897-4710-5 ISBN-10: 0-7897-4710-3 |
8/16/2011 |
| 1 | pii | First Printing: August 2011 | Second Printing: February 2012 | 2/24/2012 |
| 1 | p102 | Each core communicates with the other via th MCH (North Bridge) chip on the motherboard (see Figure 3.30). | Each core communicates with the other via th MCH (North Bridge) chip on the motherboard (see Figure 3.29). Figure Caption # fixed too. |
2/24/2012 |
| 1 | p105 | Figure 3.31 shows a cutaway view of a Core 2 Duo chip, revealing the single dual-core die underneath the heat spreader. | Figure 3.30 shows a cutaway view of a Core 2 Duo chip, revealing the single dual-core die underneath the heat spreader. Figure Caption # fixed too. |
2/24/2012 |
| 1 | p107-108 | Core i 900 Series processors using Socket LGA1366 include a triple-channel DDR3 memory controller and a high-performance FSB called QPI (Quick Path Interconnect) that connects to the north bridge component (called an I/O Hub or IOH) on the motherboard (see Figure 3.32). | Core i 900 Series processors using Socket LGA1366 include a triple-channel DDR3 memory controller and a high-performance FSB called QPI (Quick Path Interconnect) that connects to the north bridge component (called an I/O Hub or IOH) on the motherboard (see Figure 3.31). Figure Caption # fixed too. |
2/24/2012 |
| 1 | p111 | In the initial Athlon versions, AMD used a cartridge design, called Slot A, almost exactly like that of the Intel Pentium II and III (see Figure 3.33). | In the initial Athlon versions, AMD used a cartridge design, called Slot A, almost exactly like that of the Intel Pentium II and III (see Figure 3.32). | 2/24/2012 |
| 1 | p112 | Along with the change to on-die L2 cache, the Athlon was also introduced in a version for AMD’s own Socket A (Socket 462), which replaced the Slot A cartridge version (see Figure 3.34). | Along with the change to on-die L2 cache, the Athlon was also introduced in a version for AMD’s own Socket A (Socket 462), which replaced the Slot A cartridge version (see Figure 3.33). Figure captions fixed too. |
2/24/2012 |
| 1 | p113-114 | Figure 3.35 shows the Athlon XP processor that use the Barton core. | Figure 3.34 shows the Athlon XP processor that use the Barton core. Figure captions fixed too. |
2/24/2012 |
| 1 | p115 | The first Athlon 64 and 64 FX (shown in Figure 3.36) are essentially Opteron chips designed for single-processor systems. | The first Athlon 64 and 64 FX (shown in Figure 3.35) are essentially Opteron chips designed for single-processor systems. Figure captions fixed too. |
2/24/2012 |
| 1 | p116-117 | 130-nanometer (see Figure 3.37), 90nm, or 65nm cores. | 130-nanometer (see Figure 3.36), 90nm, or 65nm cores. Figure captions fixed too. |
2/24/2012 |
| 1 | p119 | Figure 3.38 illustrates the internal design of the Athlon 64 X2. | Figure 3.37 illustrates the internal design of the Athlon 64 X2. Figure captions fixed too. |
2/24/2012 |
| 1 | p120 | Figure 3.39 illustrates a Phenom II X6 processor for Socket AM3. | Figure 3.38 illustrates a Phenom II X6 processor for Socket AM3. Figure captions fixed too. |
2/24/2012 |
| 1 | p121 | Figure 3.40 illustrates the interior design of the Phenom II X6 processor. | Figure 3.39 illustrates the interior design of the Phenom II X6 processor. Figure captions fixed too. |
2/24/2012 |
| 1 | p125 | The packages are usually a metal can that is either cylindrical or oblong in shape, but they can also have other shapes or be constructed of plastic or other materials (see Figure 3.41). The sliver of quartz inside the package is normally disc shaped, but it is shaped like a tuning fork in some examples. Figure 3.42 shows a cylindrical crystal package with the cover removed, exposing the tuning fork–shaped sliver of quartz inside. |
The packages are usually a metal can that is either cylindrical or oblong in shape, but they can also have other shapes or be constructed of plastic or other materials (see Figure 3.40). The sliver of quartz inside the package is normally disc shaped, but it is shaped like a tuning fork in some examples. Figure 3.41 shows a cylindrical crystal package with the cover removed, exposing the tuning fork–shaped sliver of quartz inside. Figure captions fixed too. |
2/24/2012 |
| 1 | p125-126 | Figure 3.43 shows the interior view of a typical crystal with a disc-shaped resonator inside. The quartz disc inside has electrodes on each side, allowing voltage to be applied to the disc. The details are shown in Figure 3.44. | Figure 3.42 shows the interior view of a typical crystal with a disc-shaped resonator inside. The quartz disc inside has electrodes on each side, allowing voltage to be applied to the disc. The details are shown in Figure 3.43. Figure captions fixed too. |
2/24/2012 |
| 1 | p127 | Figure 3.45 shows a portion of a motherboard with an FTG chip and a 14.318MHz crystal below it. |
Figure 3.44 shows a portion of a motherboard with an FTG chip and a 14.318MHz crystal below it. Figure captions fixed too. |
2/24/2012 |
| 1 | p127 | Figure 3.46 shows a 32.768KHz crystal next to a chipset South Bridge or I/O controller hub, which contains the RTC circuitry and CMOS RAM. | Figure 3.45 shows a 32.768KHz crystal next to a chipset South Bridge or I/O controller hub, which contains the RTC circuitry and CMOS RAM. Figure captions fixed too. |
2/24/2012 |
| 1 | p133-134 | Heatsinks with fans are referred to as active heatsinks (see Figure 3.47). | Heatsinks with fans are referred to as active heatsinks (see Figure 3.46). Figure captions fixed too. |
2/24/2012 |
| 1 | p133-134 | Figure 3.48 shows the design used on most Socket AM3+, AM3, AM2+, AM2,940, 939, and 754 processors, featuring a cam and clip assembly on one side. | Figure 3.47 shows the design used on most Socket AM3+, AM3, AM2+, AM2,940, 939, and 754 processors, featuring a cam and clip assembly on one side. Figure captions fixed too. |
2/24/2012 |
| 1 | p135 | Figure 3.49 shows an active heatsink for Socket LGA1155 processors, featuring these snap-in retainers. | Figure 3.48 shows an active heatsink for Socket LGA1155 processors, featuring these snap-in retainers. Figure captions fixed too. |
2/24/2012 |
| 1 | p416 | Table 7.24 summarizes the requirements to break the 2.2TB barrier. |
Table 7.25 summarizes the requirements to break the 2.2TB barrier. Table captions fixed too. |
2/24/2012 |
| 1 | p506 | Table 10.4 provides a brief comparison of these drives to each other. |
Table 10.3 provides a brief comparison of these drives to each other. Table captions fixed too. |
2/24/2012 |
| 1 | p510-511 | The pinouts for the floppy controller connector are shown in Table 10.5. | The pinouts for the floppy controller connector are shown in Table 10.4. Table captions fixed too. |
2/24/2012 |
| 1 | p514 | Table 10.6 shows the technical specifications for different floppy disk media. |
Table 10.5 shows the technical specifications for different floppy disk media. Table captions fixed too. |
2/24/2012 |
| 1 | p814 | Figure 17.14 is wrong |
fixed | 2/24/2012 |